Package

MegaChips boasts a broad array of packages to provide optimal solutions.

Package Lineup

Unit:mm
TB=Thermal Boll

Package type Pin count Low thermal resistance Package size (X x Y) Max height Pin pitch
QFP/
EDHS-QFP
100 14x20 3.4 0.65
208 28x28 4.1 0.50
256 28x28 4.1 0.40
LQFP/
Exposed-LQFP
44 7x7 1.7 0.50
48 7x7 1.7 0.50
64 10x10 1.7 0.50
80 12x12 1.7 0.50
100 14x14 1.7 0.50
144 20x20 1.7 0.50
160 24x24 1.7 0.50
176 20x20 1.7 0.40
176 24x24 1.7 0.50
208 28x28 1.7 0.50
216 24x24 1.7 0.40
256 28x28 1.7 0.40
TQFP/
Exposed-TQFP
48 7x7 1.2 0.50
64 7x7 1.2 0.40
64 10x10 1.2 0.50
80 10x10 1.2 0.40
80 12x12 1.2 0.50
100 12x12 1.2 0.40
100 14x14 1.2 0.50
128 14x14 1.2 0.40
144 16x16 1.2 0.40
144 20x20 1.2 0.50
176 20x20 1.2 0.40
VQFN/
Exposed-VQFN
28 5x5 1.0 0.50
32 5x5 1.0 0.40
44 5x5 1.0 0.65
36 6x6 1.0 0.50
48 6x6 1.0 0.40
48 7x7 1.0 0.50
52 7x7 1.0 0.40
56 7x7 1.0 0.40
52 8x8 1.0 0.50
56 8x8 1.0 0.50
64 8x8 1.0 0.40
64 9x9 1.0 0.50
72 9x9 1.0 0.40
68 10x10 1.0 0.50
88 10x10 1.0 0.40
HMT/aQFN 92 5x10 0.9 0.55
116 9x9 0.9 0.50
120 9x9 0.9 0.50
Package type Pin count Package size (X x Y) Max height Pin pitch
BGA/
HSBGA
256 27x27 2.5 1.27
324(308+TB16) 27x27 2.5 1.27
352 35x35 2.5 1.27
388(352+TB36) 27x27 2.5 1.00
388(352+TB36) 35x35 2.5 1.27
396(340+TB56) 23x23 2.5 1.00
416(352+TB64) 35x35 2.5 1.27
420 35x35 2.5 1.27
456(420+TB36) 27x27 2.5 1.00
456(420+TB36) 35x35 2.5 1.27
484(420+TB64) 23x23 2.5 1.00
484(420+TB64) 35x35 2.5 1.27
516(480+TB36) 35x35 2.5 1.27
432 40x40 2.5 1.27
481(432+TB49) 40x40 2.5 1.27
520(420+TB100) 27x27 2.5 1.00
544(480+TB64) 27x27 2.5 1.00
544(480+TB64) 35x35 2.5 1.27
560(416+TB144) 31x31 2.5 1.27
564(420+TB144) 35x35 2.5 1.00
580(480+TB100) 35x35 2.5 1.00
652 45x45 2.5 1.27
676(full grid) 27x27 2.5 1.00
676(576+TB100) 31x31 2.5 1.00
680(580+TB100) 35x35 2.5 1.00
724(660+TB64) 35x35 2.5 1.00
820(720+TB100) 37.5x37.5 2.5 1.00
829(780+TB49) 40x40 2.5 1.00
929(829+TB100) 40x40 2.5 1.00
1296(full grid) 37.5x37.5 2.5 1.00
LBGA 172(156+TB16) 17x17 1.7 1.00
176(160+TB16) 15x15 1.7 1.00
256(full grid) 17x17 1.7 1.00
324(full grid) 19x19 1.7 1.00
FCBGA 400(full grid) 21x21 2.5 1.00
HFC-BGA 676(full grid) 27X27 3.5 1.00
900(full grid) 31x31 3.5 1.00
957(full grid) 40x40 3.5 1.27
1156(full grid) 35x35 3.5 1.00
1296(full grid) 37.5x37.5 3.5 1.00
1521(full grid) 40x40 3.5 1.00
1760(full grid) 42.5x42.5 3.5 1.00
LFBGA 157(122+TB35) 9x9 1.7 0.50
196(full grid) 10x10 1.7 0.65
256 17x17 1.7 0.80
280(256+TB24) 15x15 1.7 0.65
304 16x16 1.7 0.80
316(300+TB16) 14x14 1.7 0.65
352(320+TB32) 15x15 1.7 0.65
376(340+TB36) 15x15 1.7 0.65
400(364+TB36) 14x14 1.7 0.50
432(full grid) 13x17 1.7 0.65
448(384+TB64) 15x15 1.7 0.65
512(412+TB100) 15x15 1.7 0.50
Package type Pin count Package size (X x Y) Max height Pin pitch
TFBGA 48(full grid) 7x7 1.2 0.75
105(full grid) 4.8x9.5 1.2 0.60
112 10x10 1.2 0.80
144 12x12 1.2 0.80
169(144+TB25) 13x13 1.2 0.80
176 13x13 1.2 0.80
208 15x15 1.2 0.80
225(176+TB49) 13x13 1.2 0.80
256 17x17 1.2 0.80
292(256+TB36) 17x17 1.2 0.80
329(320+TB9) 18x18 1.2 0.80
VFBGA 64(full grid) 6x6 1.0 0.70
64(full grid) 7x7 1.0 0.75
84 6x6 1.0 0.50
84(full grid) 5x11 1.0 0.75
100 6x6 1.0 0.50
100(full grid) 8x8 1.0 0.75
112(full grid) 5x11 1.0 0.65
112 10x10 1.0 0.80
156(121+TB35) 9x9 1.0 0.50
SPBGA 340
2PKG STACK
15x15
1.7 0.65
420
2PKG STACK
15x15 1.7 0.65
MPBGA 529(480+TB49) 31x31 2.5 1.00

SIP(System in Package)

MegaChips offers systems in package; SIPs. An SIP contains ASIC, SDRAM, Flash and other ICs incorporated into a single package.

Package type Side by Side Chip Stack Package Stack
Structure
Benefit Low profile and high heat radiation Small size and high density Mounted with high capacity memories

Lineup

Side by Side

Side by Side

Package type Pin count Package size (X x Y) Max height Pin pitch
LFBGA 316 14×14 1.40 0.65
432 13×17 1.40 0.65
BGA 324 27×27 2.30 1.27
1296 37.5×37.5 2.23 1.00
1296 37.5×37.5 2.90 1.00

Chip Stack

Chip Stack

Package type Pin count Package size (X x Y) Max height Pin pitch
LFBGA 144 10x10 1.60 0.65
432 13x17 1.40 0.65
448 15x15 1.50 0.65
Exposed
TQFP
64 7x7 1.20 0.40
80 10x10 1.20 0.40
100 12x12 1.20 0.40
128 14x14 1.20 0.40
176 20x20 1.20 0.40
Exposed
LQFP
144 20x20 1.70 0.50
256 28x28 1.70 0.40

Package Stack

Package Stack

Package type Pin count Package size (X x Y) Max height Pin pitch
SPBGA 340 15×15 1.70 0.65
420 15×15 1.70 0.65

Package Stack

Package Stack

Package type Pin count Package size (X x Y) Max height Pin pitch
MPBGA 529 31×31 2.36 1.00

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