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Technology

Mixed-Signal Technology

Integration of Analog and Digital

Electronic devices used in a variety of fields, including mobile communications, networking, automotive, FA, robotics, and medical, require reduced size and power consumption as well as high functionality. Meanwhile, mixed-signal technology, which combines digital and analog circuits, is becoming increasingly important.
For mixed-signal SoC design, which is becoming progressively complex with the advance in semiconductor integration, the knowledge and skills in noise reduction, signal quality, thermal management, package design, and PCB design are essential. MegaChips has accumulated expertise based on extensive experience in both digital and analog areas, providing mixed-signal solutions that make full use of our knowledge.

High-Speed Serial Interface

MegaChips has more than fifteen years of experience and continues to improve our technology in high-speed serial interfaces such as SerDes for a passive optical network (PON), V-by-One for the display timing controller, and an embedded DisplayPort (eDP). The burst mode clock and data recovery (CDR) SerDes technology that we have accumulated is capable of flexibly supporting a wide range of PON standards and is widely used both domestically and internationally. It also supports high-speed SerDes with multi-protocol and various high-speed serial interfaces that are available.

Features

  • Ultra high speed burst data lock CDR
  • Flexible lane configuration
  • Multi-protocol support

Examples of Support Standards

  • 10G-EPON/XGPON: 1Gbps ~ 10.3125Gbps
  • Multi-protocol (PCI-Express Gen1-4, SATA1-3, JESD204B, etc.)
  • V-by-One: 1.62Gbps ~ 4.0Gbps
  • eDP: 1.62Gbps~5.4Gbps

Analog Front End (AFE)

High performance ADC, DAC, programmable-gain amplifier (PGA), current amplifier (IAMP), PLL, and filters are implemented in our AFE IP that was developed in pursuit of high performance and low cost. Therefore, it can be applied not only to ASIC SoCs but also to high-performance general-purpose AFE chips. MegaChips technology, which has a shipping record of more than 50 million units of high-performance AFE products over the last decade, is at the core of high-speed communication products and is highly regarded by customers around the world.

Features

  • 12-bit 200Msps ~ 1200Msps ADC
  • 12-bit 200Msps ~ 1200Msps DAC
  • Low-noise PGA: -12dB ~ +48dB of gain range
  • Low-jitter PLL

Examples of Support Standards

  • G.hn ITU-T Recommendation G.9960
  • G.hn-mimo ITU-T Recommendation G.9963
  • G.fast ITU-T Recommendation G.9700
  • HomePNA 3.1 ITU-T Recommendation G.9954
  • HD-PLC
  • Roadmap of AFE

Analog IP Platform for FA

MegaChips has a development platform for various analog macros required for industrial equipment. In addition to IO-Link transceiver IP, we have a variety of analog macros such as an ADC, DAC, clock generator, and LED driver required for sensor interface. And we contribute to miniaturization and cost reduction through development platforms that can be customized to meet customer needs.

Features

  • Device transceiver IP that is compliant with IO-Link Specification Ver1.1.3
  • Lineup of analog macro needed for building sensor interfaces such as an ADS, DSC, OSC, LDO, and LED driver
  • Customized design for miniaturization and cost reduction
  • Utilization Idea of Analog IP Platform

LSI Package Cooperative Design Technology Based on SI/PI Analysis

MegaChips supports a wide range of package lineups to meet customer needs. We conduct cooperative designs for LSI and packages using our signal integrity/power integrity (SI/PI) analysis and thermal analysis techniques to provide the best solutions to customers.

  • Analog IP Platform
  • Example of thermal analysis of SiP
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